Onafhankelijke informatie & betrouwbare reviews
Menu
Gebruik de pijltjes toetsen om van boven naar beneden te navigeren tussen de aanbevolen zoekwoorden.

Lenovo 4ZC7A08709 - Specificaties

Geen reviews beschikbaar Schrijf een review
Lenovo 4ZC7A08709
Beste deals
€ 239,40 Gratis verzending Amazon Marketplace Marketplace Bekijk € 212,67 Gratis verzending bol. Plaza Marketplace Bekijk
Voeg toe aan vergelijker Prijs volgen
Algemeen
Toelichting type
-
Partnumber
4ZC7A08709
Op Kieskeurig sinds
September 2019
Intern geheugen type
DDR4
Geheugen voor
PC/server
Geheugen kloksnelheid
2933 MHz
Intern geheugen
32 GB
Algemene kenmerken
Modeljaar
2019
Eancode
0889488486410
extra
gen_category
geheugenmodule

Toelichting specificaties

ThinkSystem TruDDR4 Memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. We use the highest quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for TruDDR4 Memory. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.\n\nHigh Performance Memory\n\nLenovo offers high-performance and high-capacity memory options in ThinkSystem servers.\n\nPersistent Memory\n\nLenovo ThinkSystem servers configured with Intel Optane DC Persistent Memory transforms the memory/storage hierarchy enabling faster insights from data. This breakthrough technology delivers large capacity, high speed, affordable memory with data persistence and advanced encryption capabilities. These DDR4 compatible modules significantly increase the capacity of available system memory, keeping more hot data closer to the CPU, and enabling greater operational efficiency by processing larger data sets with more user instances.\n\n3DS RDIMMs\n\nTo meet the ever increasing demand for higher density server memory modules, Lenovo offers 3DS (3 Dimensional Stacked) DDR4 RDIMMs which apply TSV (Through Silicon Via) technology from our partnership with a leading Tier 1 DRAM supplier. The new TSV 3DS stack technology enables higher density DRAM stack packages with higher operational frequency and reduced power consumption. The RDIMM configuration along with 3DS TSV DRAM packages exhibits performance benefits and lower power consumption over alternative high density solutions to ultimately provide the lowest TCO for data centers.\n\nPerformance+ Memory\n\nMemory intensive workloads needing a competitive advantage will benefit from Lenovo’s Performance+ memory. Lenovo engineers worked in partnership with leading memory suppliers to develop and tune ThinkSystem servers enabling them to exceed the latest industry standard for memory performance. Lenovo’s Performance+ memory delivers increased bandwidth and lower latency at 2933 MHz with memory all channels fully populated.